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작성자: 관리자 작성일: 2010-07-16 조회수: 7516 |
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[Welcome to RadTech Asia 2011] The 12th International Conference on Radiation Curing in Asia (RadTech Asia 2011) will be held in Yokohama, Japan during June 20-23, 2011. It is my great honor and pleasure to invite you to RadTech Asia 2011 as the chair of the Organizing Committee. As is well known, UV-light/electron beam (UV/EB) processing technology has been used in a wide range of industries from surface finishing process of paper, plastic and metal to fabrication and molding, utilizing the mechanism of chemical reactions excited by UV-light and electron beams. In Japan, this UV/EB processing technology is a core technology in the fields of electronics and information industries, such as optical fiber processing, fabrication of electronics parts such as liquid crystal displays and printed circuit boards, as well as adhesion or surface processing of CD/DVD. This is the result of active research and development worldwide in areas related to resource/energy saving and low environmental load/reduction of carbon dioxide emissions, the importance of which has recently been rediscovered. UV/EB processing technology is also gaining attention in the fabrication and processing of nano-imprints, nano-machines, optical devices and holographic memory in recent years. Accordingly, the RadTech Asia 2011 will focus on the current market trend of UV/EB processing at home and abroad and on its technical issues, and will offer an opportunity to exchange information to create new seeds of the future science, technology and industry. It will also include discussions on various topics such as the development of recyclable and biodegradable materials, energy-saving processes, and high-performance exposure equipment as environment-friendly technologies, measurement devices, and technologies as the basis of the nanotech industry and high-efficiency nano-materials. Tadatomi Nishikubo / President of RadTech JAPAN and Chair of the Organizing Committee ** Further information of the Conference is available on our website: http://www.radtechasia2011.org/ [Items to be submitted] 1. Abstract Deadline: September 30, 2010 (JST) Submission: Only on-line submission. No fax and e-mail submissions will be accepted. Format: On the on-line submission form, you are requested to fill in the following items in the text format (in English): - Name of all Authors - Contact information of the Presenting Author - Paper Category - Presentation Type (prefered) - Presentation Title - Abstract (up to 250 words) Paper Category 1) Special Sessions S-1 Nano Imprint S-2 Nano Lithography S-3 Green Technology S-4 New Trend in Display Technology S-5 Technology of Film Molding System 2) General Sessions: G-1 Equipment: UV/EB Systems, Laser Sources G-2 Chemistry: Monomers, Prepolymers, Additives, Reaction Mechanisms G-3 Chemical Analysis, Properties, Measurement G-4 Printings G-5 Coatings (Wood, Metals, Inorganic Materials, Plastics, Papers, Films) G-6 Adhesives (Laminating, Pressure Sensitive, Release Coating) G-7 Photofabrications: 3D-Fabrication, Micro- and Nano-fabrications G-8 Electronics (UV/BE Resists, Packaging Materials) G-9 Optronics (Devices, Processing, Materials) G-10 Others Abstracts will be reviewed by the members of the relevant program committee and the notification of acceptance will be announced at the end of November, 2010. [Abstract Submission] Start: June 1, 2010 Deadline: September 30, 2010 Deadline of Manuscript for Proceedings: February 28, 2011 Registration Early Bird Registration Start: October, 2010 Early Registration Deadline: April 28, 2011 Late Registration Deadline: May 31, 2011 |
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| ▶ | RadTech Asia 2011 개최 안내 | 관리자 | 2010-07-16 | 7516 |
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